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3D & Systems Summit | 28-30 January 2019 | Dresden, Germany

Are you interested in exploring the latest challenges and trends in heterogeneous integration and 3D packaging?

Join SEMI Europe at the 3D & Systems Summit from January 28 – 30, 2019 in Dresden, Germany!


The Summit will address the most relevant and controversial topics related to 3D integration and System-in-Package manufacturing and applications. The event will feature a brand-new agenda, high-caliber speakers, an exhibition area, and unique networking opportunities. The program includes presentations by leading companies ASE, Intel, Amkor, Fraunhofer IZM, imec, GLOBALFOUNDRIES, Qualcomm RFFE, STMicroelectronics, Osram, Deca Technologies, and many more!

Don’t miss this opportunity to meet with industry leaders and learn about the latest packaging technologies.

Early Bird Price is available until January 1st. IEEE EPS members are eligible for an additional ten percent discount using promo code: suQ3w —Register today! 


Key Topics:

  • Heterogeneous Integration & System-in-Package
  • 3D Integration
  • Active & Passive Interposers
  • Panel Level Integration
  • 5G Antenna & Package Integration
  • Packaging for Optics & Photonics Applications



Heterointegration – The Path to Future Complex Intelligent Systems

Professor Hubert Lakner, Director 
Fraunhofer-Institute for Photonic Microsystems IPMS


Heterogeneous Integration – The Future of Packaging

Steffen Kroehnert, Senior Director Technology Development, Business Development Europe
Amkor Technology Holding B.V. Germany



Join our growing list of exhibitors and register for a booth today

For more information contact: or