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ABSTRACT
Device scaling has brought about a great increase in the diversity of materials used in semiconductor fabrication. While planar (horizontal) scaling continues to drive great improvements in device density and performance, it has been joined by vertical scaling, adding to the palette of options in the race to develop novel architectures, particularly around device memory.
2DNAND is giving way to 3DNAND, with 3DNAND structures reaching and exceeding 100 layers. This, in turn, creates new challenges for fab equipment, processes, and the materials used to form these novel structures. In this webinar, we will explore trends in material requirements for new generations of device architecture, with special focus on the evolution of 3DNAND devices and the impact of the 3rd dimension on these materials. Mark Thirsk, Managing Partner of Linx Consulting, will address trends impacting the overall materials industry and discuss the significance of 3DNAND to the materials market. He will be followed by Scotten Jones, Founder and President of IC Knowledge, who will review the evolution of 3DNAND devices and the impact of these devices on key materials.
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